Title:
プリモールドタイプパッケージを有するパッケージ化されたマイクロチップ
Document Type and Number:
Japanese Patent JP4695652
Kind Code:
B2
Abstract:
A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.
Inventors:
Carpman, Maurice S.
Hubblezell, Nicole
Pharrell, Peter W.
Judy, Michael W..
Felton, Lawrence E.
Long, lewis
Hubblezell, Nicole
Pharrell, Peter W.
Judy, Michael W..
Felton, Lawrence E.
Long, lewis
Application Number:
JP2007534570A
Publication Date:
June 08, 2011
Filing Date:
July 05, 2005
Export Citation:
Assignee:
Analog Devices, Inc.
International Classes:
G01C19/56; B81B3/00; B81B7/00; H01L23/06; H01L23/08; H01L23/12; G01P15/08
Domestic Patent References:
| JP2002214057A |
Foreign References:
| US20040041254 | ||||
| US20040041248 | ||||
| WO1991005368A1 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita