Title:
光ルミネセンス層状構造体を備えるパッケージ化された白色発光デバイス
Document Type and Number:
Japanese Patent JP7242894
Kind Code:
B2
Abstract:
A light emitting device includes a Chip Scale Packaged (CSP) LED, the CSP LED including an LED chip that generates blue excitation light; and a photoluminescence layer that covers a light emitting face of the LED chip, wherein the photoluminescence layer comprises from 75 wt % to 100 wt % of a manganese-activated fluoride photoluminescence material of the total photoluminescence material content of the layer. The device/CSP LED can further include a further photoluminescence layer that covers the first photoluminescence and that includes a photoluminescence material that generates light with a peak emission wavelength from 500 nm to 650 nm.
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Inventors:
Jun-Gan Tsao
Ghan Warn
Lee Chun Li
Ghan Warn
Lee Chun Li
Application Number:
JP2021556907A
Publication Date:
March 20, 2023
Filing Date:
March 17, 2020
Export Citation:
Assignee:
INTEMATIX CORPORATION
International Classes:
H01L33/50; C09K11/61; C09K11/64; C09K11/80
Domestic Patent References:
| JP2016042579A | ||||
| JP2018113411A | ||||
| JP2017520917A | ||||
| JP2016072614A |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Yoshizawa Yuro
Mitsutsugu Sugimura
Yoshizawa Yuro
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