Title:
PACKAGE FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2022185157
Kind Code:
A
Abstract:
To provide a package for mounting electronic component in which the high frequency property is improved, and an electronic device and an electronic module having excellent high frequency property.SOLUTION: A package for mounting electronic component comprises: a coaxial line (11) which has a signal line (11p) and an external conductor (11o); and a microstrip substrate (20N) which has signal wiring (20) that is bent in a direction intersecting an extension direction from the extension direction of the coaxial line. The signal wiring (20) comprises: a first portion (21) being an end on the side connected to one end of the signal line (11p); a second portion (22) extending in the direction intersecting the extension direction; and a third portion (23) located between the first portion (21) and the second portion (22). A width (L1) of the first portion is wider than a width (La1) of the signal line and a width (L11) of the second portion. An edge of the third portion (23) on the outer peripheral side of the signal wiring is a curve that is outwardly convex.SELECTED DRAWING: Figure 3
Inventors:
KITAHARA HIKARI
Application Number:
JP2019194295A
Publication Date:
December 14, 2022
Filing Date:
October 25, 2019
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01S5/022; H01L23/12
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune