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Title:
PACKAGING BODY FOR PACKAGING MANY DUCT HEAT INSULATING MATERIALS AND ITS PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2006131295
Kind Code:
A
Abstract:

To provide a packaging body for packaging many duct heat insulating materials and its production method for lowering the numbers of lifts by an elevator or of transportation by a transporting vehicle etc. from a factory to a working site, not requiring much storage space at a working site and not generating the cut ends or leftovers of the materials during work.

In structuring this packaging body 100 for packaging many duct heat insulating materials, the duct heat insulating materials 1 used for covering a duct and comprising the laminated body of a soft mat-like heat insulating material and a sheet-like top coating material is folded in 2-5, stacked in a large number, compressed and is stored to be vacuum packaged in a bag shaped body 6.


Inventors:
ITO YASUHIRO
KARIBE IKUO
Application Number:
JP2004325636A
Publication Date:
May 25, 2006
Filing Date:
November 09, 2004
Export Citation:
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Assignee:
SANKI ENG CO LTD
International Classes:
B65D85/07; B65B31/04; B65B63/02; B65D30/24; B65D81/20
Domestic Patent References:
JPS6228779U1987-02-21
JP2002211660A2002-07-31
JP2000030839A2000-01-28
JPS6160418A1986-03-28
Attorney, Agent or Firm:
Yukio Murata