Title:
低温塗布ホットメルト接着剤配合物の包装
Document Type and Number:
Japanese Patent JP4908529
Kind Code:
B2
Abstract:
Films having a melting point below about 100°C are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking.
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Inventors:
Paul, Charles W.
Rogers, Anthony Pee.
Rogers, Anthony Pee.
Application Number:
JP2009023930A
Publication Date:
April 04, 2012
Filing Date:
February 04, 2009
Export Citation:
Assignee:
Henkel Akchen Gesell Shaft Und Company Comandito Gezel Shaft A Off Akchen
International Classes:
B65B3/04; C09J201/00; B29B13/02; B65B63/08; B65D65/02; C09J123/02; C09J123/08
Domestic Patent References:
| JP7508956A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Nagasaka Tomoyasu
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Nagasaka Tomoyasu