Title:
PACKAGING MATERIAL, AND PACKAGE PREPARED THEREWITH
Document Type and Number:
Japanese Patent JP2016172572
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a packaging material that improves the self-standing properties of a plastic film, has proper strength for the protection of contents, and also has excellent heat sealability and impact resistance, and a package.SOLUTION: A packaging material has a substrate layer, and at least a heat adhesive resin layer above the substrate layer. In the heat adhesive resin layer, a first resin layer and a second resin layer are in close contact with each other for lamination, a boundary between the first resin layer and the second resin layer is formed in an uneven shape, and the second resin layer has a concave shape/convex shape corresponding to a convex shape/concave shape formed in the first resin layer.SELECTED DRAWING: Figure 1
Inventors:
KIMURA KAZUTERU
Application Number:
JP2015053085A
Publication Date:
September 29, 2016
Filing Date:
March 17, 2015
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65D65/40; B32B3/26; B32B27/00; B65D75/52