To provide a packaging material for a photosensitive material excellent in moisture-proof property, oxygen barrier property, sealing performance, antistatic performance, photographic properties and suitability to incineration and adaptable to the Containers and Packaging Recycling Law.

The packaging material has a high Young's modulus heat resistant thermoplastic resin film layer having ≥50 kg/mm2 Young's modulus in the longitudinal direction (ASTM D 882), ≥130°C melting point by DSC (differential scanning calorimetry) and 5-70 μm thickness, a barrier film layer disposed on one face or both faces of the thermoplastic resin film layer, having 50-3,000 (5-300nm) thickness and comprising a metallic thin film layer and/or a thin film layer of an inorganic material and a heat sealable layer disposed on the inside (photosensitive material side) of the barrier film layer optionally by way of an adhesive layer and based on an ethylene/α-olefin copolymer resin to be a main component obtained by polymerization with a single-site catalyst.