Title:
PACKAGING MATERIAL
Document Type and Number:
Japanese Patent JP2021191688
Kind Code:
A
Abstract:
To provide a packaging material that is highly recyclable, has excellent heat resistance and strength, and can be heat-sealed.SOLUTION: The packaging material of the present invention includes a base material, a seal layer arranged on at least one side of the base material, and an adhesive layer arranged between the base material and the seal layer, in which the base material contains an ultra-high molecular weight polyethylene-based resin having a viscosity-average molecular weight of 300,000 or more, a content ratio of the ultra high molecular weight polyethylene-based resin is 40 pts.wt. or more, with respect to 100 pts.wt. of resins in the base material, a thickness of the base material is 5 μm to 80 μm, a melting point of the base material is higher than a melting point of the seal layer by 30°C or more, and the seal layer contains a low molecular weight polyethylene-based resin.SELECTED DRAWING: Figure 1
Inventors:
ARITOME NORIFUMI
MORI TOYOICHIRO
HAMAGUCHI KIYOTAKA
TAKAHATA HIROAKI
MORI TOYOICHIRO
HAMAGUCHI KIYOTAKA
TAKAHATA HIROAKI
Application Number:
JP2020098749A
Publication Date:
December 16, 2021
Filing Date:
June 05, 2020
Export Citation:
Assignee:
NAGASE & CO LTD
SETSUNAN KASEI KK
NAGASE PLASTICS CORP
SETSUNAN KASEI KK
NAGASE PLASTICS CORP
International Classes:
B65D65/40; B32B27/32
Attorney, Agent or Firm:
Katsuto Momii
Katsuya Takashina
Katsuya Takashina