To provide a packaging method of an electronic component in which deterioration in packaging efficiency due to bonding all electronic components by a transparent laser bonding system is avoided while suppressing gap in bonding position due to difference in thermal expansion coefficient between the electronic component and a mother board 1, and bonding failure of an electrode pad 3 and a bonding electrode can be suppressed.
In the packaging method of an electronic component, such a mother board 1 as a first bonding layer is formed on the surface of a part of a plurality of electrode pads 3 and a second bonding layer 7 composed of a conductive material having a melting point higher than that of the first bonding layer is formed on the surface of other electrode pad 3 is employed, and the mother board 1 mounting the electronic component on the first bonding layer is placed in a reflow furnace which is kept at a temperature lower than the melting point of the second bonding layer 7. Following to a reflow bonding step for bonding a part of electrode pads 3 and the electronic component by melting only the first bonding layer, a new electronic component 200 is mounted on the second bonding layer 7 which is then irradiated with a laser beam and melted.
MORIYAMA EIJI
YAMADA HIDEKI
| JPS61263297A | 1986-11-21 | |||
| JP2003060339A | 2003-02-28 | |||
| JPS56165333A | 1981-12-18 | |||
| JPS63164296A | 1988-07-07 | |||
| JPH11320133A | 1999-11-24 |
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