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Title:
PACKAGING METHOD AND TOOL OF ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPH05291797
Kind Code:
A
Abstract:

PURPOSE: To improved efficiency and reliability for parts packaging work and parts replacement work in a packaging method of electronic parts for connecting the terminal of electronic parts to the electrode of a surface-packaging printed circuit board and then packaging parts.

CONSTITUTION: In a packaging method of electronic parts for packaging parts by connecting a terminal 41 of electronic parts 40 to an electrode 51 of a surface packaging printed circuit board 50, the terminal 41 of the electronic parts 40 is pressure-welded to the electrode 51 of the surface packaging printed circuit board 50 by utilizing retrieval force of an elastic body member 10, thus packaging the electronic parts 40 to the surface packaging printed circuit board 50.


Inventors:
FURUKAWA HIROSHI
Application Number:
JP9622992A
Publication Date:
November 05, 1993
Filing Date:
April 16, 1992
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H05K13/04; H05K3/34; H05K3/32; (IPC1-7): H05K13/04; H05K3/34
Attorney, Agent or Firm:
Teiichi



 
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