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Patent Searching and Data


Title:
PACKAGING MOUNT
Document Type and Number:
Japanese Patent JP3702392
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a packaging mount capable of reliably preventing a breakage of a resin-made film to package a commodity or the like.
SOLUTION: The packaging mount 1 has two faces adjacent to each other formed by folding the packaging mount at a fold-guide part 15 formed on the surface. The fold-guide part 15 is formed to generate a remaining portion on at least end parts of either one, and has a pair of auxiliary fold-guide parts 11 and 11 arranged on the two faces adjacent to each other across the fold-guide part 15 on at least an end part of either one of the fold-guide part 15, and an extension part 16 of the fold-guide part 15 is located between outer ends 11b and 11b in the pair of auxiliary fold-guide parts 11 and 11.


Inventors:
Yuga Nakajima
Application Number:
JP2004083056A
Publication Date:
October 05, 2005
Filing Date:
March 22, 2004
Export Citation:
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Assignee:
KOBAYASHI PHARMACEUTICAL CO.,LTD.
International Classes:
B65D73/00; B65D71/00; B65D71/10; (IPC1-7): B65D73/00
Domestic Patent References:
JP3088253U
JP61032055U
JP2000355360A
Attorney, Agent or Firm:
Eiji Saegusa
Yasumitsu Tate
Shinichi Mashita
Kimio Matsumoto
Tachibana Kenji