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Patent Searching and Data


Title:
PACKAGING MULTILAYER FILM AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JP2627729
Kind Code:
B2
Abstract:

PURPOSE: To obtain a packaging multilayer film superior in gas barrier properties and light-shielding properties by a method wherein a resin composition layer having a good adhesion to a metallizing surface of a metallized polyropylene film and little deterioration of mechanical strength after processing is provided on the metallizing surface.
CONSTITUTION: On a metallizing surface of a metallized polypropylene film, a resin composition layer is provided, which is composed of 5-30 pts.wt. ethylene/ ethylene unsatd. carboxylate copolymer and 95-70 pts.wt. ethylene/ethylene unsatd. carboxylic acid/ethylene unsatd. carboxylate copolymer, contains 1-10wt.% ethylene unsatd. carboxylic acid, and has a melt flow rate of 15-50dg/ min.


Inventors:
Kenji Miharu
Matsunuma Seihei
Tatsuya Watanabe
Naozumi Suzuki
Toshiyuki Nishioka
Yoshio Nozaki
Kenichi Date
Application Number:
JP23972194A
Publication Date:
July 09, 1997
Filing Date:
August 29, 1994
Export Citation:
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Assignee:
Mitsui DuPont Polychemical Co., Ltd.
International Classes:
B32B15/08; B32B15/082; B32B15/085; B32B27/32; B32B37/15; C08L33/04; C08L33/06; (IPC1-7): B32B15/08; B32B15/08; B32B27/32; B32B31/30; C08L33/06