Title:
PACKAGING SUBSTRATE AND SEMICONDUCTOR INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2023113866
Kind Code:
A
Abstract:
To provide a packaging substrate and a semiconductor device including the substrate that can be applied to high-speed circuits by greatly improving electrical characteristics such as signal transmission speed and making the insulating film treatment process simpler by substantially preventing the generation of parasitic elements.SOLUTION: A semiconductor device 100 includes an element section 30 containing semiconductor elements 32, 34, 36 and a packaging substrate 20 electrically connected to the element sections 32, 34, 36, and by applying a glass substrate as a core to the packaging substrate 20, the semiconductor elements are more closely connected to the motherboard 10 so that electrical signals are transmitted over a maximum short distance.SELECTED DRAWING: Figure 1
Inventors:
KIM SUNGJIN
RHO YOUNGHO
KIM JINCHEOL
JANG BYUNG KYU
RHO YOUNGHO
KIM JINCHEOL
JANG BYUNG KYU
Application Number:
JP2023094175A
Publication Date:
August 16, 2023
Filing Date:
June 07, 2023
Export Citation:
Assignee:
ABSOLICS INC
International Classes:
H01L23/15; H01L23/12
Attorney, Agent or Firm:
SK Patent Attorney Corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito