Title:
研磨品用包装用品及びその製造方法
Document Type and Number:
Japanese Patent JP2009500250
Kind Code:
A
Abstract:
A system for packaging resin bonded molded abrasive articles having a flexible package comprising at least one sidewall defining an enclosed volume and at least one resin bonded abrasive article positioned within the enclosed volume. The sidewall comprises a multilayer barrier composite having a water vapor transmission rate that is less than 0.5 grams per 645 square centimeters (100 square inches) per 24 hours.
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Inventors:
Mark G. Schwabel
Jeffrey W. Nelson
Joseph A. Scheller
Jeffrey W. Nelson
Joseph A. Scheller
Application Number:
JP2008519622A
Publication Date:
January 08, 2009
Filing Date:
June 28, 2006
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
B65D85/00; B24D3/00; B24D3/28; B24D18/00; B65D65/40; B65D71/08; B65D75/30; B65D81/24; B65D85/02
Domestic Patent References:
| JPH08151082A | 1996-06-11 | |||
| JPS5323759B1 | 1978-07-17 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Takuji Yamada
Muneo Yamamoto
Masaishi Nishishita
Yuko Goto
Takuji Yamada
Muneo Yamamoto
Masaishi Nishishita
Yuko Goto