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Patent Searching and Data


Title:
PACKAGING SYSTEM FOR TEST SENSOR
Document Type and Number:
Japanese Patent JP2003139777
Kind Code:
A
Abstract:

To provide a test device not depending on a size of a test sensor package provided with a test sensor, and to provide a method of loading the test sensor package in the test device.

The test device for analyzing the glucose concentration in a blood sample is fitted to take out the test sensor from the sensor package. The test device includes an inlet area and a piercing member. The inlet area receives a part of the sensor package extended inwardly from an outer periphery of the test sensor package. The piercing member is fitted to be extended to the inlet area, to pierce the sensor package, and to be engaged with a fitting part of the test sensor. The piercing member is fitted to hold the test sensor on the inlet area by a method to take out the package, and the test sensor is held on the inlet area during a time testing the blood sample.


Inventors:
CHARLTON STEVEN C
Application Number:
JP2002238219A
Publication Date:
May 14, 2003
Filing Date:
August 19, 2002
Export Citation:
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Assignee:
BAYER AG
International Classes:
G01N33/66; B01L99/00; G01N21/78; G01N27/28; G01N27/327; G01N27/416; G01N33/483; G01N33/487; G01N35/00; G01N37/00; (IPC1-7): G01N33/66; G01N21/78; G01N27/28; G01N27/327; G01N27/416; G01N33/483
Attorney, Agent or Firm:
Hajime Tsukuni (1 person outside)