Title:
PACKING FOR DELIVERY OF SEMICONDUCTOR APPARATUS
Document Type and Number:
Japanese Patent JPH01139370
Kind Code:
A
Abstract:
PURPOSE:To control moisture-absorption of a semiconductor apparatus by filling a packed container for delivery, including semiconductor apparatus, with a gas having a particular molecular weight and by seal-packing it with a drying reagent. CONSTITUTION:A packed container 1 for delivery is an air-tight bag-form package made of a thin film, in which semiconductor apparatus is contained in an inner vessel 4 and a drying reagent like silica gel, etc., is included insides and nitrogen gas N2, carbon dioxide gas CO2 or at least a kind of gas having an average molecular weight no less than 28 is fully charged. Then it is heat- sealed at a heat-seal part 6 at an opening of the packed container 1.
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Inventors:
SAITO TAKEHIRO
Application Number:
JP29825987A
Publication Date:
May 31, 1989
Filing Date:
November 25, 1987
Export Citation:
Assignee:
NEC CORP
International Classes:
B65D81/20; B65D81/26; H01L23/00; (IPC1-7): B65D81/20; B65D81/26; H01L23/00
Domestic Patent References:
| JP62168363B |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)