PAD FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD

Title:

PAD FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD

Document Type and Number:

Japanese Patent JP2005246599

Kind Code:

A

Abstract:

To provide a pad for chemical mechanical polishing capable of suitably being applied to STI technology to obtain a flat polished surface and imparting high polishing speed with a sufficient service life, and a chemical mechanical polishing method using the pad.

This pad contains (A) polystyrene or styrene copolymer and (B) diene-based (co)polymer (except styrene copolymer).

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Inventors:

KAWAHARA KOJI
OKAMOTO TAKAHIRO
SHIHO KOUJI
HASEGAWA TORU

Application Number:

JP2005024679A

Publication Date:

September 15, 2005

Filing Date:

February 01, 2005

Export Citation:

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Assignee:

JSR CORP

International Classes:

B24B37/20; B24B37/24; C08J5/14; C08K3/24; C08L5/16; C08L9/00; C08L25/06; C08L35/00; H01L21/304; (IPC1-7): B24B37/00; C08J5/14; C08K3/24; C08L5/16; C08L9/00; C08L25/06; C08L35/00; H01L21/304

Domestic Patent References:

JP2001214154A	2001-08-07
JP2002134445A	2002-05-10

Attorney, Agent or Firm:

Masataka Oshima

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