PURPOSE: To prevent development of deficiency of a solder application amount and a bridge between adjacent conductors by constituting an arrangement direction size of one outermost conductor of conductors of a conductor having a size which is wider than an arrangement direction size of other conductors and by providing the conductor with an area whereto solder is not attached and an escape area.

CONSTITUTION: An arrangement direction size A of at least one outermost conductor 1a of conductors 1 is constituted of a conductor 1a whose size is wider than an arrangement direction size B of other conductors 1b. The conductor 1a is provided with an area 3 whereto solder is not attached and an escape area 4. Therefore, when an application amount of a solder 2 applied to each conductor 1 is the same, the solder 2 is prevented from flowing out in the area 3. When an application amount of solder to the outermost conductor 1a is too much, solder can be escaped to the escape area 4. Thereby, it is possible to prevent development of deficiency of a solder application amount and a bridge between adjacent conductors.