Title:
Palladium plating solution, palladium plating method, palladium plating products, sliding contact materials and sliding contacts
Document Type and Number:
Japanese Patent JP6346475
Kind Code:
B2
Inventors:
Katsuya Tsuyama
Takafumi Kubo
Horie Toru
Satoshi Suzuki
Hirotoshi Kagita
Sugawara parent
Takafumi Kubo
Horie Toru
Satoshi Suzuki
Hirotoshi Kagita
Sugawara parent
Application Number:
JP2014053810A
Publication Date:
June 20, 2018
Filing Date:
March 17, 2014
Export Citation:
Assignee:
Matsuda Sangyo Co., Ltd.
THE FURUKAW ELECTRIC CO.,LTD.
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D3/52; C25D7/00; H02K13/00
Domestic Patent References:
| JP2000034593A | ||||
| JP2013023693A | ||||
| JP2001355093A | ||||
| JP2001335986A | ||||
| JP2008081765A | ||||
| JP56163294A | ||||
| JP7102392A | ||||
| JP2011084774A |
Foreign References:
| US4673472 |
Attorney, Agent or Firm:
Konno Akio
Minoru Inami
Takeyasu Ito
Keisei Tamura
Minoru Inami
Takeyasu Ito
Keisei Tamura