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Title:
SOCKET FOR INSPECTING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3233195
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To reduce the number of part items and to simplify a structure by providing elastomer connectors between a lead frame and a circuit board for electrical conduction.
SOLUTION: In installing a socket on a circuit board 20, the connecting conductive segments 42 of a lead frame 40 are firstly extended to the connecting holes 36 of a socket body 30. The connecting parts 42a of the lead frame 40 are kept into contact with one surfaces of elastomer connectors 50 for housing metallic thin lines penetrated in the thickness direction. Now, the positioning pins 33 of the socket body 30 are penetrated into the positioning holes 23 of a substrate 20; simultaneously, bolts are penetrated into the installing holes of the socket body 30 and those of the board 20 to install the socket body 30 on the board 20. Thus. the socket body 30 is mounted on the circuit board 20 without soldering. The deteriorated or damaged lead frame 40 or elastomer connectors 50 are removable from the board 20 for repeated use of the substrate 20. Thus, the low number of part items and a simple structure are achieved.


Inventors:
Koichi Yamazaki
Hiroto Komatsu
Application Number:
JP18995596A
Publication Date:
November 26, 2001
Filing Date:
July 02, 1996
Export Citation:
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Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
G01R1/04; H01L23/32; H01R11/01; H01R33/76; G01R31/26; (IPC1-7): H01R33/76; G01R31/26; H01L23/32; H01R11/01
Domestic Patent References:
JP9161870A
JP917535A
JP8335486A
JP855648A
JP6300815A
JP6180344A
JP6177286A
JP6119960A
JP495883A
JP1248650A
Attorney, Agent or Firm:
Minoru Yakushi (1 person outside)



 
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