PURPOSE: To prevent increase of inductance of chip components arranged in parallel and connected in parallel by connecting adjacent chip components, while crossing, through an external conductor.
CONSTITUTION: When chip components 1 arranged vertically are connected through an external conductor 5, electrode 6 of the external conductor 5 is soldered or welded to the electrode 2 of the chip component 1. Consequently, two external conductors 5 are crossed and two chip components 1 are arranged vertically while holding two external conductors 5 between and connected in parallel. When two chip components 1 are arranged vertically in parallel and crossed through two external conductors 5, currents flow reversely through two chip components 1 thus reducing mutual inductance.
OKA HIRONORI
MIKAZUKI TETSUO
