To provide a parallel line pattern forming method with which transparency and stability of a resistance value are improved in a thin line pattern of a conductor, a substrate with a transparent conductive film attached thereto having characteristics excellent in improving transparency when compared with other cases of using the identical resistance value, a device having the substrate with the transparent conductive film attached thereto, and an electronic apparatus equipped with the device.
In a parallel line pattern forming method to form a parallel line pattern which includes a conductive material and which has at least one or more pairs of parallel lines on a substrate, the parallel line pattern forming method includes: a step to form a line-shaped liquid including the conductive material and having a uniform line width on the substrate; and a step to selectively deposit the conductive material on the edge of the line-shaped liquid by evaporating the line-shaped liquid while controlling a state of convection of the line-shaped liquid, in which a composition of the line-shaped liquid, a contact angle between the substrate and the line-shaped liquid, and concentration and a drying condition of the conductive material are selected such that the state of convection for selectively depositing the conductive material on the edge of the line-shaped liquid is brought about.
OYA HIDENOBU
USHIKU MASAYUKI
YAMAUCHI MASAYOSHI
| JP2012054078A | 2012-03-15 | |||
| JP2005152758A | 2005-06-16 | |||
| JP2012054078A | 2012-03-15 |
| WO2011090034A1 | 2011-07-28 | |||
| WO2011090034A1 | 2011-07-28 |