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Title:
PARAMETER ADJUSTING DEVICE FOR PROCESS MODEL, PARAMETER ADJUSTMENT SUPPORTING DEVICE AND ITS METHOD
Document Type and Number:
Japanese Patent JP3740382
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To allow a process engineer who does not fully understand the internal structure of process, to easily execute parameter adjustment.
SOLUTION: A process model parameter adjusting device is provided with a process data collecting means constituted of a process external input collecting means and a process output collecting means, a means for simulating a process model having a parameter set constituted of a plurality of parameters by inputting data supplied through the process data external input collecting means, a means for setting the initial value of the parameter of the process model, a means for analyzing the change of the sensitivity of the parameter, a means for extracting a parameter set whose sensitivity is high based on the analyzed result of the sensitivity, and a means for defining the values of the respective parameters of the parameter set so that an error between the process output simulation value and the process output value can be minimized.


Inventors:
Yamanaka Osamu
Akihiro Nagaiwa
Masahiko Tsutsumi
Matsumae Manabu
Masaki Kishihara
First deer Yukio
Application Number:
JP2001132998A
Publication Date:
February 01, 2006
Filing Date:
April 27, 2001
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
C02F3/12; G05B13/04; G05B13/02; (IPC1-7): G05B13/04; C02F3/12; G05B13/02
Domestic Patent References:
JP2000148209A
JP10301979A
JP5197811A
JP8329123A
JP2001022726A
JP10235333A
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Satoshi Nazuka
Hideyuki Mori
Hirohito Katsunuma