PART MOUNTING SUBSTRATE, ELECTRONIC CIRCUIT DEVICE, NON-RECIPROCAL CIRCUIT ELEMENT, AND COMMUNICATION DEVICE

Title:

PART MOUNTING SUBSTRATE, ELECTRONIC CIRCUIT DEVICE, NON-RECIPROCAL CIRCUIT ELEMENT, AND COMMUNICATION DEVICE

Document Type and Number:

Japanese Patent JP2008060999

Kind Code:

A

Abstract:

To provide a part mounting substrate that reduces size, thickness, and costs effectively and has a structure capable of manufacturing a non-reciprocal circuit element having stable characteristics with a high yield, and to provide the non-reciprocal circuit element and a communication device using the non-reciprocal circuit element.

The part mounting substrate has a conductive substrate 10 and an insulation film 11. The insulation film 11 comprises an electrodeposition film. On at least one surface of the conductive substrate 10, there are ground electrodes 110-116 for exposing the surface of the conductive substrate 10. The insulation film 11 covers the entire surface of the conductive substrate 10 except the ground electrodes 110-116.

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Inventors:

KINOSHITA TAKESHI
SAKAI MINORU
SASA SHOZO
SATO HIROSHI
OGIMOTO TATSUO

Application Number:

JP2006236748A

Publication Date:

March 13, 2008

Filing Date:

August 31, 2006

Export Citation:

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Assignee:

TDK CORP

International Classes:

H01P1/36; H01P1/383; H01P11/00

Attorney, Agent or Firm:

Mijiro Abe
Yoshikazu Takei

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