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Title:
LOCAL DRY ETCHING DEVICE
Document Type and Number:
Japanese Patent JP2016081948
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a local dry etching device having a plurality of different working characteristics while suppressing the number of components or increase of an installation area of the local dry etching device.SOLUTION: A local dry etching device 1 comprises: a single vacuum chamber 2; a plurality of gas introduction means 3 each formed from a discharge tube 31 including an injection tip 311 that is open within the vacuum chamber 2; a single work table 4 disposed within the vacuum chamber 2 for placing a work W thereon; a table drive device 41; a table drive control device 42; a gas supply device 5 for supplying a material gas to the gas introduction means 3; a single electromagnetic wave oscillator 81; a plasma generation part 312 which is formed in the discharge tube 31 of each of the gas introduction means; and electromagnetic wave transfer means 83 including electromagnetic wave switch means 82 capable of switching to irradiate one of the plasma generation parts 312 with electromagnetic waves. Each of the gas introduction means 3 injects a plasma having different working characteristics.SELECTED DRAWING: Figure 4

Inventors:
OBARA YASUTSUGU
Application Number:
JP2014208630A
Publication Date:
May 16, 2016
Filing Date:
October 10, 2014
Export Citation:
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Assignee:
SPEEDFAM CO LTD
International Classes:
H01L21/3065; H05H1/46
Domestic Patent References:
JP2015053454A2015-03-19
JP2007267083A2007-10-11
JP2004134661A2004-04-30
JP2004055931A2004-02-19
JP2004047559A2004-02-12
JP2002151478A2002-05-24
JP2000133639A2000-05-12
JPH1187094A1999-03-30
Attorney, Agent or Firm:
Masakage Amano



 
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