Title:
PARTIAL PLATING DEVICE
Document Type and Number:
Japanese Patent JP3343062
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a partial plating device capable of achieving an excellent partial plating by a method wherein a pad part of a lead frame is not projected downward even when the lead frame is pressed by a masking plate and a pressing plate during the partial plating, and the adhesivity of an elastic material to the lead frame is not damaged even when the elastic material attached to the surface of the pressing plate is deteriorated.
SOLUTION: A pressing plate 14a of a partial plating device comprises a back plate holder 13, a first elastic material layer 16 provided with a supporting plate 15 at the part corresponding to an opening part in a masking plate on the surface of the back plate holder 13 and provided with an elastic material 11b in an area other than the supporting plate 15, and a second elastic material layer 17 consisting of an elastic material 11c to cover the surface of the first elastic material 16.
Inventors:
Tsutomu Irie
Application Number:
JP24620997A
Publication Date:
November 11, 2002
Filing Date:
August 26, 1997
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
C25D5/02; C25D7/12; H01L23/50; (IPC1-7): C25D5/02; C25D7/12; H01L23/50
Domestic Patent References:
JP61207590A | ||||
JP60183757A | ||||
JP61129874U | ||||
JP28149U |
Attorney, Agent or Firm:
Takahisa Kimura