PURPOSE: To obtain a partially soldered clad material which is stuck with solder only in the required places by cladding solder of a specified areas at specified intervals on a high m.p. metallic belt-like body.

CONSTITUTION: Recesses 3 are inscribed at specified intervals on a high m.p. metallic belt-like body, for example, a Cu belt-like body 1. Solder 2 is installed in the recesses 3, and the same is rolled with rolls R, whereby the solder 2 and the material 1 are clad. Since the clad material has a specified solder stuck area and does not use any flux, there is no effect of the flux, and the clad material is ideally suited as an electronic parts material.