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Patent Searching and Data


Title:
パーティクルボード
Document Type and Number:
Japanese Patent JP6663750
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a particle board which is light-weight, has excellent dimensional stability and mechanical strength, and is excellent in designability.SOLUTION: A particle board contains a bamboo fiber chip having a length of 2-50 mm and a thickness of less than 15 mm, a bark chip and a resin component for adhesion; and has a multilayer structure having a fibrous layer where a ratio of the bamboo fiber chip is 20 pts.wt. or more and 100 pts.wt. or less with respect to 100 pts.wt. of the total of the bamboo fiber chip and the bark chip and a surface layer formed on one surface or both surfaces of the fibrous layer directly or through an intermediate layer. The particle board is light-weight, and is excellent in dimensional stability and mechanical strength. The surface layer is formed into a powder layer formed from mixed powder of bamboo-derived powder and the bark powder, and thereby has unique designability originating in the bamboo fiber chip and the bark ground product, and accordingly can be suitably used as a surface material such as a wall material and a floor material.SELECTED DRAWING: Figure 1

Inventors:
清岡 ▲高▼敏
Hisayuki Okada
Application Number:
JP2016037855A
Publication Date:
March 13, 2020
Filing Date:
February 29, 2016
Export Citation:
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Assignee:
Takex Lab Co., Ltd.
Marco Construction Co., Ltd.
International Classes:
B27N3/02; B27D5/00; B27M3/00; B27N3/06; B32B21/02
Domestic Patent References:
JP2015157456A
JP2005238806A
JP35005492Y1
JP2002079506A
JP10138210A
JP2014008617A
JP6293008A
JP2011093125A
JP3099127U
Foreign References:
US20070122616
Attorney, Agent or Firm:
Kenichiro Matsuo
Hisashi Kato
Keita Tohsaka
Hiroshi Mori
Toru Minase