Title:
PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2020200458
Kind Code:
A
Abstract:
To provide particles which can effectively suppress aggregation when a conductive part is formed on a surface, and can effectively suppress occurrences of plating cracking and plating peeling.SOLUTION: Particles include base material particles, and resin particles or a resin layer arranged on the surface of the base material particles, in which compressive elastic modulus when the resin particles or the resin layer is compressed by 10% is larger than compressive elastic modulus when the base material particles are compressed by 10%, compressive elastic modulus when the base material particles are compressed by 10% is 1,000 N/mm2 or less, and compressive elastic modulus when the resin particles or the resin layer is compressed by 10% is 8,000 N/mm2 or less.SELECTED DRAWING: Figure 1
Inventors:
ABE DAIKI
UEDA SAORI
YAMADA YASUYUKI
UEDA SAORI
YAMADA YASUYUKI
Application Number:
JP2020098652A
Publication Date:
December 17, 2020
Filing Date:
June 05, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08F289/00; C08F2/44; H01B1/00; H01B1/22; H01B5/16; H01L21/60
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office