Title:
粒子、接続材料及び接続構造体
Document Type and Number:
Japanese Patent JP7265599
Kind Code:
B2
Abstract:
Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 µm or more and 15 µm or less, the particles have a 10% K value of 30 N/mm 2 or more and 3000 N/mm 2 or less, and the particles have a particle diameter CV value of 50% or less.
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Inventors:
Mai Yamagami
Satoshi Haneda
Wakiya Takeshi
Yasuyuki Yamada
Saori Ueda
Masao Sasahira
Satoshi Haneda
Wakiya Takeshi
Yasuyuki Yamada
Saori Ueda
Masao Sasahira
Application Number:
JP2021165444A
Publication Date:
April 26, 2023
Filing Date:
October 07, 2021
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/52; B22F1/17; C09J9/02; C09J201/00; H01L21/60; B22F1/05; B22F1/10
Domestic Patent References:
| JP2012209097A | ||||
| JP2014081928A | ||||
| JP2012064559A | ||||
| JP2012248531A | ||||
| JP2015176823A | ||||
| JP2015176824A | ||||
| JP2014116112A | ||||
| JP2014123456A | ||||
| JP2014127464A | ||||
| JP2013115013A | ||||
| JP2014192051A | ||||
| JP2005216973A | ||||
| JP11158448A |
Foreign References:
| WO2009119788A1 | ||||
| WO2010013668A1 |
Attorney, Agent or Firm:
Patent Attorney Osaka Front Patent Office
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