Title:
部品把持具
Document Type and Number:
Japanese Patent JP6788750
Kind Code:
B2
Abstract:
A component gripping tool including: a pair of claws configured to grip multiple pins or leads of an electronic component; a contact surface provided between the pair of claws and configured to contact a leading end of at least two of the multiple pins or leads being gripped by the pair of claws, wherein an escape section is formed in the contact surface such that the pair of claws and the contact surface do not interfere with each other when the pair of claws is gripping the two multiple pins or leads.
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| JPH0760842 | [Title of Invention] Flip Chip Mounting Device |
Inventors:
Kenta Narumi
Sugiyama Katsuji
Fujishiro Takeshi
Sugiyama Katsuji
Fujishiro Takeshi
Application Number:
JP2019545506A
Publication Date:
November 25, 2020
Filing Date:
September 28, 2017
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/04; B23Q7/04; B25J15/08
Domestic Patent References:
| JP2017228461A | ||||
| JP62201967U | ||||
| JP61156300U | ||||
| JP200325162A | ||||
| JP5269689A | ||||
| JP6314762A | ||||
| JP2001246590A |
Foreign References:
| US5142777 | ||||
| US3800416 |
Attorney, Agent or Firm:
Patent business corporation NEXT
Yasutaka Fukatsu
Yuki Kataoka
Yasutaka Fukatsu
Yuki Kataoka