Title:
部品搭載装置
Document Type and Number:
Japanese Patent JP7422331
Kind Code:
B2
Abstract:
To provide a component mounting device capable of improving the mounting quality while suppressing the occurrence of suction mounting errors.SOLUTION: The component mounting device mounts a component picked up from a component supply unit by vacuum suction with a suction nozzle provided to a mounting head onto a circuit board. The component mounting device includes: a pneumatic source that is connected to a nozzle opening provided at a tip of a suction nozzle at the side where the component is sucked via a pipeline; a contact member that is provided around the nozzle opening, and comes into contact with the component; a storage unit that stores at least a specific area of the component mounting device; a control unit that controls to bring the contact member into contact with the specific area based on the storage unit; a flow sensor that measures a flow rate of the pipeline when the contact member is brought into contact with the specific area; and a determination unit that determines whether or not the contact member is defective based on the flow rate.SELECTED DRAWING: Figure 7
Inventors:
Hironori Kitajima
Shinji Yamamoto
Shinji Yamamoto
Application Number:
JP2020078394A
Publication Date:
January 26, 2024
Filing Date:
April 27, 2020
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B25J15/06; H05K13/04
Domestic Patent References:
| JP2020025122A | ||||
| JP2008244159A | ||||
| JP2012504053A | ||||
| JP2000159472A | ||||
| JP11340689A |
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office