Title:
部品パッケージング方法と部品パッケージ装置
Document Type and Number:
Japanese Patent JP6878990
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a component packaging method in which components are accommodated in a carrier tape so as to implement stably packaging of high quality, and a component packaging apparatus.SOLUTION: As a cover tape T2 is superimposed on the upper surface of a carrier tape T1 in which components are loaded orderly in concavities, the components are encapsulated inside the carrier tape T1. The crimping situation of the cover tape T2 to the carrier tape T1 is image-recognized, to acquire image information of the crimping situation, and, based on the image information, the sealing load of a sealing device 14 is adjusted.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
Masayoshi Kobayashi
Application Number:
JP2017060533A
Publication Date:
June 02, 2021
Filing Date:
March 27, 2017
Export Citation:
Assignee:
tdk Corporation
International Classes:
B65B15/04; B65D73/02
Domestic Patent References:
| JP2000289709A | ||||
| JP5170231A | ||||
| JP8230833A | ||||
| JP2009126532A |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation