Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PARTS PLACEMENT BOARD FOR LEAD CUTTING DEVICE, AND LEAD CUTTING DEVICE
Document Type and Number:
Japanese Patent JPH1190570
Kind Code:
A
Abstract:

To reduce the manufacturing cost, to cut a lead of various parts, and to change the lead length after cutting at a low cost.

In a parts placement board 20 for a lead cutting device which is mounted on the lead cutting device to cut a plurality of leads projecting from a parts to the prescribed length, provided with a plurality of hole parts to insert the leads from an upper part, and cuts the lead projecting from a lower surface together with a moving blade advancing/retracting along the lower surface, a base board 34 in which a plurality of hole parts 32 are formed with the prescribed intervals and the lead is cut together with a moving blade 54, and a guide board 38 which is mounted on the base board 34 in an attachable/detachable manner, and in which a plurality of guide holes 36 in which the leads can be inserted are formed at the position corresponding to the hole parts 32 to the intervals of the leads, are provided.


More Like This:
WO/2003/009958BLANK FEEDING METHOD
Inventors:
TAKAHASHI TORU
Application Number:
JP27814697A
Publication Date:
April 06, 1999
Filing Date:
September 24, 1997
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JAPAN RADIO CO LTD
International Classes:
B23D15/00; B21F11/00; B23D33/02; H01L23/50; H05K13/04; (IPC1-7): B21F11/00; B23D15/00; B23D33/02; H01L23/50; H05K13/04
Attorney, Agent or Firm:
Shinji Sakai