Title:
部品供給装置および部品搬送システム
Document Type and Number:
Japanese Patent JP7362776
Kind Code:
B2
Abstract:
A parts supply device includes a stage having a placement surface on which a plurality of parts is placed, an imaging system configured to image the plurality of parts from an obliquely upward direction with respect to the placement surface of the stage, and a parts detection unit configured to detect positions and orientations of the plurality of parts on the placement surface of the stage based on image information obtained by the imaging system.
Inventors:
Yuta Imai
Hiroaki Higashi
Hideaki Hosaka
Hiroaki Higashi
Hideaki Hosaka
Application Number:
JP2021563979A
Publication Date:
October 17, 2023
Filing Date:
December 08, 2020
Export Citation:
Assignee:
Kyoto Manufacturing Co., Ltd.
Chugai Pharmaceutical Co., Ltd.
Chugai Pharmaceutical Co., Ltd.
International Classes:
B65G47/14; B65G47/91; G01B11/00; G01B11/25; G01B11/26
Domestic Patent References:
| JP6298335A | ||||
| JP8002655A | ||||
| JP6040545A | ||||
| JP9166426A | ||||
| JP4283052A |
Attorney, Agent or Firm:
Hiroshi Okabe
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