Title:
TRANSMITTING/RECEIVING PASSIVE ELEMENT AND INTEGRATED MODULE THEREOF
Document Type and Number:
Japanese Patent JP2003283286
Kind Code:
A
Abstract:
To provide a transmitting/receiving passive element and its integrated module.
The transmitting/receiving passive element comprises: a semiconductor substrate or dielectric substrate; at least one capacitor formed on the substrate; a dielectric layer formed on the capacitor and the substrate; at least one inductor formed on the dielectric layer; vias piercing the dielectric layer; metal electrodes formed in the vias for electrically connecting the capacitor and the inductor; a high frequency signal line for the inductor and the capacitor; and a high frequency ground formed separately from the high frequency signal line on the substrate.
Inventors:
SO INSO
Application Number:
JP2002329191A
Publication Date:
October 03, 2003
Filing Date:
November 13, 2002
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L23/522; H01L27/01; H01L27/04; H03H7/01; H03H7/075; H01L21/822; H03H7/46; H04B1/40; H05K1/16; H05K3/46; (IPC1-7): H03H7/075; H01L21/822; H01L27/04; H03H7/46
Attorney, Agent or Firm:
Yukio Ono (1 person outside)