Title:
ペースト塗布装置、電子部品接合装置、ペースト塗布方法及び電子部品接合方法
Document Type and Number:
Japanese Patent JP5195626
Kind Code:
B2
Inventors:
Shinji Sasaguri
Horie Isao
Horie Isao
Application Number:
JP2009113255A
Publication Date:
May 08, 2013
Filing Date:
May 08, 2009
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L21/52; B05C5/00; B05D1/26; B05D3/00
Domestic Patent References:
| JP2006061824A | ||||
| JP63097259A | ||||
| JP6296916A | ||||
| JP2056271A | ||||
| JP2122858A | ||||
| JP3217271A | ||||
| JP11244757A |
Attorney, Agent or Firm:
Hiroki Naito
Kentaro Fujii
Ikuro Terauchi
Kentaro Fujii
Ikuro Terauchi