PURPOSE: To efficiently apply solder paste to a surface mounting printed circuit board in a predetermined pattern with high precision.

CONSTITUTION: A plurality of printed circuit boards 1-1-1-3 are held on the board holding parts 2-1-2-3, held in a movable state by respective drivers 3-1-3-3, and the positions of them are detected at the time of printing by a position detector 5 and the drivers 3-1-3-3 are controlled corresponding to the detection result by a control device 4 to correct the misregistration of the printed circuit boards 1-1-1-3 with respect to a printing mask 6 to apply the printing of solder paste to a plurality of the printed circuit boards 1-1-1-3 by the single printing mask 6.