Title:
PASTE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP09067505
Kind Code:
A
Abstract:
To provide a highly heat-resistant paste which has low curing shrinkage and can give a cured product having excellent heat resistance, low hygroscopicity and film strength and to provide a semiconductor device surface- protected with such a paste.
This paste composition comprises 100 pts.wt. polyquinoline resin or polyquinoxaline resin, 100-3,500 pts.wt. silicon dioxide powder and 200-3,500 pts.wt. organic solvent. This semiconductor device is prepared by applying this paste composition to the surface of a semiconductor part to form a protective film thereon.
Inventors:
Nomura, Yoshihiro
Dodo, Takashi
Iioka, Shinji
Dodo, Takashi
Iioka, Shinji
Application Number:
JP1995000226135
Publication Date:
March 11, 1997
Filing Date:
September 04, 1995
Export Citation:
Assignee:
HITACHI CHEM CO LTD
International Classes:
C08L65/00; C09D5/25; C09D165/00; H01L21/56; H01L23/29; H01L23/31; C08L65/00; C09D5/25; C09D165/00; H01L21/02; H01L23/28; (IPC1-7): C08L65/00; C09D5/25; C09D165/00; H01L21/56; H01L23/29; H01L23/31