To provide a highly heat-resistant paste which has low curing shrinkage and can give a cured product having excellent heat resistance, low hygroscopicity and film strength and to provide a semiconductor device surface- protected with such a paste.
This paste composition comprises 100 pts.wt. polyquinoline resin or polyquinoxaline resin, 100-3,500 pts.wt. silicon dioxide powder and 200-3,500 pts.wt. organic solvent. This semiconductor device is prepared by applying this paste composition to the surface of a semiconductor part to form a protective film thereon.