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Title:
PASTE FOR FORMATION OF SOLDER GROUND LAYER
Document Type and Number:
Japanese Patent JP2013168240
Kind Code:
A
Abstract:

To provide a paste for formation of a solder ground layer which is disposed on a metal member and is burned thereby reacting with an oxide film occurring on a surface of the metal member and forming a solder base layer on the metal member and inhibits the occurence of swelling and wrinkles on the surface of the metal member even when being subject to power cycle and heat cycle loading.

A paste for formation of a solder ground layer is disposed on a metal member and is burned thereby forming a solder base layer on the metal member. The paste for the formation of the solder ground layer includes silver powder, glass powder, crystalline oxide powder, a resin, and a solvent.


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Inventors:
NISHIMOTO SHUJI
NISHIKAWA MASAHITO
NAGATOMO YOSHIYUKI
Application Number:
JP2012029683A
Publication Date:
August 29, 2013
Filing Date:
February 14, 2012
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
H01B1/22
Domestic Patent References:
JPH0322306A1991-01-30
JP2010287869A2010-12-24
JP2010287554A2010-12-24
Foreign References:
WO2005078828A12005-08-25
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa



 
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