To provide paste for joining a copper member which is capable of controlling the generation of cracks in a ceramic member without thickly forming a hard Ag-Cu eutectic structure layer, even if the copper member and the ceramic member are joined, and which is capable of surely joining the copper member with the ceramic member, and to provide a method for manufacturing a joined body using the paste for joining the copper member.
Paste for joining a copper member used in joining a copper member comprising copper or copper alloy and a ceramic member, includes a powder component containing Ag and a nitride-forming element, a resin, and a solvent. The composition includes 0.4 mass% or more and 75 mass% or less of the nitride-forming element and the balance of Ag and inevitable impurities.
NAGATOMO YOSHIYUKI
NISHIKAWA MASAHITO
KUROMITSU YOSHIO
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Tadashi Takahashi
Hiroshi Masui
Fumihiro Hosokawa