Title:
PASTY RESIN COMPOSITION, HIGH HEAT-CONDUCTIVE MATERIAL, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022018051
Kind Code:
A
Abstract:
To provide a pasty resin composition which enables production of a material having improved electric conductivity.SOLUTION: A pasty resin composition contains silver-containing particles A, a solvent B and a thermosetting resin C, in which a difference between a Hansen solubility parameter a of the silver-containing particles A and a Hansen solubility parameter b of the solvent B, which are measured by the following method, is 4.3 or more and 9.8 or less. [Method] A method visually evaluates dispersibility after having added 2 mL of any solvent selected from solvents for evaluation such as water, methanol, toluene and propylene glycol monomethyl ether to 0.2 g of the silver-containing particles A, into a 10 ml volume glass container, and stirred the mixture by a vortex mixer for 5 seconds, in four grades. The method inputs the solvent for evaluation and the evaluation result of the dispersibility to the solvent using computer software, and calculates the Hansen solubility parameter.SELECTED DRAWING: None
Inventors:
HAMASHIMA AZUMI
KASHINO TOMOMASA
YOSHIDA MASATO
ABE YUI
WATANABE NAOKI
TAKAMOTO MAKOTO
KASHINO TOMOMASA
YOSHIDA MASATO
ABE YUI
WATANABE NAOKI
TAKAMOTO MAKOTO
Application Number:
JP2020154938A
Publication Date:
January 26, 2022
Filing Date:
September 15, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L101/00; C08K3/08; C08L63/00; H01L21/52
Attorney, Agent or Firm:
Shinji Hayami