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Title:
金属系被着体接着用ペースト状銀組成物、その製造方法および金属系被着体の接着方法
Document Type and Number:
Japanese Patent JP4347381
Kind Code:
B2
Abstract:
Disclosed is a paste-like silver composition wherein silver particles are easily sintered when heated, thereby forming a solid silver which is excellent in strength, electrical conductivity and thermal conductivity. Also disclosed is a method for producing such a paste-like silver composition. Specifically disclosed is a paste-like silver composition composed of spherical silver particles having an average particle diameter of 0.1-6 µm and a carbon content of not more than 0.50 weight%, preferably not more than 0.25 weight%, and a volatile dispersion medium. When this paste-like silver composition is heated, the dispersion medium evaporates and the spherical silver particles are sintered together, thereby forming a solid silver. Also specifically disclosed are a method for producing such a paste-like silver composition, a method for producing a solid silver by heating the paste-like silver composition, a solid silver having excellent strength, electrical conductivity and thermal conductivity, a bonding method using the paste-like silver composition, and a method for manufacturing a circuit board.

Inventors:
Kimio Yamakawa
Mine Victory
Application Number:
JP2007517877A
Publication Date:
October 21, 2009
Filing Date:
May 24, 2006
Export Citation:
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Assignee:
Nihon Handa Co., Ltd.
International Classes:
H01B1/22; B22F1/10; B22F7/04; B22F9/00; B22F9/24; C22C5/06; H01B1/00; H01B13/00; H05K3/12
Domestic Patent References:
JP2005048237A
JP2001325831A
JP2005093380A
JP2005005054A
JP2001035255A
Attorney, Agent or Firm:
Kubota Yoshitan



 
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