To enable a paste material transferring material which is used at the time of applying a paste material to a semiconductor integrated circuit or a printed board to prevent the damage given to a work by reducing the load imposed upon the work from a pin and, in addition, making the load selectable even when the work largely warps and, at the same time, the floating of the pin.

This paste material transferring device which is used at the time of applying the paste material to the part to be coated of the work is provided with a jig 7 having a plurality of through holes 6, a plurality of pins 5 which are vertically movably inserted into the holes 6, and flange sections 8 which are respectively provided in the upper parts of the pins 5 and have larger diameters than the holes 6 have. The device is also provided with a pressing-down member 9 which is installed so that the member 9 may come into contact with the upper ends of the pins 5.