Title:
高熱伝導性材料用ペースト状樹脂組成物、高熱伝導性材料、および半導体装置
Document Type and Number:
Japanese Patent JP7279802
Kind Code:
B2
Abstract:
This paste-like resin composition contains: (A) a (meth)acryloyl group-containing compound that is bifunctional or higher and has two or more linear or branched oxyalkylene group repeating units; and (B) metal-containing particles that include silver-containing particles or copper-containing particles.
Inventors:
Naoki Watanabe
Yui Abe
Makoto Takamoto
Yui Abe
Makoto Takamoto
Application Number:
JP2021545737A
Publication Date:
May 23, 2023
Filing Date:
January 21, 2021
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08F299/02; C08K3/08; H01L21/52
Domestic Patent References:
| JP2017106023A | ||||
| JP2009295895A | ||||
| JP11316456A | ||||
| JP2013026089A | ||||
| JP2011150897A | ||||
| JP2014074132A | ||||
| JP2011122129A | ||||
| JP2004139754A |
Foreign References:
| WO2019167819A1 |
Attorney, Agent or Firm:
Shinji Hayami
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