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Patent Searching and Data


Title:
PATTERN COATING DEVICE FOR HOT-MELT ADHESIVE AND PATTERN COATING METHOD FOR HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2011245465
Kind Code:
A
Abstract:

To make a pattern roll coating work free at a desired position independently of a means of a device body for supplying heated and melted hot-melt adhesive when applying a pattern coating of the hot-melt adhesive.

A pattern coating device includes a device body having a supply device for heated and melted hot-melt adhesive and a transfer tool 2 in which a transfer roll is pivotally installed at a support frame and is characterized in that the heated and melted hot-melt adhesive is supplied to the surface of the transfer roll in a pre-determined pattern distribution and the transfer roll is detachable from the device body having the supply device. Roll coating work is performed by supplying the heated and melted hot-melt adhesive in the pre-determined pattern distribution to the surface of the transfer roll B from the supply device 1 of the device body, moving the transfer roll B of the transfer tool 2 to a contact position of a substrate to be coated and transferring the melted hot-melt adhesive which is adhered to the surface of the transfer roll B to the substrate surface.


Inventors:
HIDAKA SHOJI
Application Number:
JP2010132436A
Publication Date:
December 08, 2011
Filing Date:
May 23, 2010
Export Citation:
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Assignee:
SUNTOOL CORP
International Classes:
B05C1/08; B05C1/02; B05D1/28; B05D7/24
Attorney, Agent or Firm:
Fumio Okumura