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Title:
PATTERN FORMATION MATERIAL AND PATTERN FORMATION METHOD
Document Type and Number:
Japanese Patent JP3676331
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a resist pattern having a good pattern shape when a resist pattern is formed using exposing light having a wavelength of ≤180 nm band with minimally producing scum.
SOLUTION: A pattern formation material comprising a base resin containing a unit represented by formula 1 and a unit represented by formula 2 and an acid generator is provided. In the formulae, R1 and R2 are the same or different and each H, Cl, F, alkyl or fluoroalkyl; R3 is a protecting group which is released by an acid; m is an integer of 0-5; and a and b satisfy 0<a<1, 0<b<1 and 0<a+b≤1.


Inventors:
Kishimura, Shinji
Endo, Masataka
Sasako, Masaru
Ueda, Mitsuru
Fujigaya, Takehiko
Application Number:
JP2002000250215
Publication Date:
July 27, 2005
Filing Date:
August 29, 2002
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G03F7/039; C08F8/00; C08F212/14; C08F228/02; C08F232/00; C08K5/00; C08L25/18; C08L41/00; C08L45/00; G03F7/00; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F8/00; C08F212/14; C08F228/02; C08F232/00; C08K5/00; C08L25/18; C08L41/00; C08L45/00; H01L21/027
Domestic Patent References:
JP2000330289A
JP2003524211A
JP2000330288A
JP2001066780A
Attorney, Agent or Firm:
前田 弘
小山 廣毅
竹内 宏
嶋田 高久
竹内 祐二
今江 克実
手島 勝
藤田 篤史