Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PATTERN FORMATION METHOD
Document Type and Number:
Japanese Patent JP2009134273
Kind Code:
A
Abstract:

To provide a pattern formation method capable of plotting a photosensitive material for an ultraviolet ray in a pattern with high throughput by a mask-less direct plotting exposure device having an irradiating light source being an h-line in a main wavelength.

The pattern formation method comprises: a step of forming, on a substrate, a first photosensitive material of low sensitivity to the h-line of the main wavelength irradiated from the mask-less direct plotting exposure device but of high sensitivity to energy line including the ultraviolet light ; a step of forming a second photosensitive material of high sensitivity on the first photosensitive material to the h-line of the main wavelength; a step of plotting a second pattern by using the mask-less direct plotting exposure device to the second photosensitive material; a step of developing the second photosensitive material; a step of collectively exposing the second photosensitive material and the first photosensitive material formed with the second pattern; a step of separating the second photosensitive material; and a step of forming an objective first pattern by developing the first photosensitive material.


Inventors:
Kato, Yukiko
Yamaguchi, Yoshihide
Hasebe, Takehiko
Kishi, Masakazu
Yamaguchi, Takeshi
Application Number:
JP2008000268468
Publication Date:
June 18, 2009
Filing Date:
October 17, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI VIA MECHANICS LTD
International Classes:
G03F7/095; G03C5/00; G03F7/20; H05K3/00; H05K3/28
Domestic Patent References:
JPH0254270A1990-02-23
JPS6061752A1985-04-09
JP2002229212A2002-08-14
JP2001242618A2001-09-07
JPH0498260A1992-03-30
JPH11338158A1999-12-10
JPH0254270A1990-02-23
JPS6061752A1985-04-09
JP2002229212A2002-08-14
JP2001242618A2001-09-07