Title:
パターン形成方法
Document Type and Number:
Japanese Patent JP5106020
Kind Code:
B2
Abstract:
After forming a lower layer film, an intermediate layer film and a first resist film on a substrate, a first resist pattern is formed by performing first exposure. Then, after a first intermediate layer pattern is formed by transferring the first resist pattern onto the intermediate layer film, a second resist film is formed thereon, and a second resist pattern is formed by performing second exposure. Thereafter, a second intermediate layer pattern is formed by transferring the second resist pattern onto the intermediate layer film. After removing the second resist film, the lower layer film is etched by using the second intermediate layer pattern as a mask, so as to form a lower layer pattern.
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Inventors:
Masataka Endo
Masako Sasako
Masako Sasako
Application Number:
JP2007248783A
Publication Date:
December 26, 2012
Filing Date:
September 26, 2007
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
H01L21/027; G03F7/11; G03F7/40
Domestic Patent References:
| JP2002175981A | ||||
| JP2000356854A | ||||
| JP5166769A | ||||
| JP5341536A | ||||
| JP2007164203A | ||||
| JP574676A | ||||
| JP63246822A |
Attorney, Agent or Firm:
Maeda patent office
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura