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Title:
PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2013020090
Kind Code:
A
Abstract:

To provide a pattern forming method excellent in both of dray etching durability and exposure latitude (EL), to provide an actinic ray-sensitive or radiation-sensitive resin composition to be used for the pattern forming method, and to provide a resist film formed by the pattern forming method, and a method for manufacturing an electronic device and an electronic device.

The pattern forming method includes steps of (1) forming a film by using the following actinic ray-sensitive or radiation-sensitive resin composition; (2) exposing the film by use of an ArF excimer laser, and (3) developing the exposed film by use of a developing solution containing an organic solvent to form a negative pattern. The resin composition comprises: a resin (A) having a repeating unit (a) having a polycyclic aromatic group and a repeating unit (b) having a group that is decomposed by an action of an acid to generate a carboxyl group; and a compound (B) generating an acid by irradiation with actinic rays or radiation.


Inventors:
Saito, Shoichi
Takahashi, Hidetomo
Yamaguchi, Shuhei
Koshijima, Kosuke
Application Number:
JP2011000153234
Publication Date:
January 31, 2013
Filing Date:
July 11, 2011
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/32; C08F212/00; C08F220/10; C08F232/08; G03F7/004; G03F7/038; G03F7/039; H01L21/027
Domestic Patent References:
JP2011221513A2011-11-04
JP2011170316A2011-09-01
JP2013064971A2013-04-11
JP2010217884A2010-09-30
JP2011022560A2011-02-03
JP2007112898A2007-05-10
Attorney, Agent or Firm:
高松 猛
尾澤 俊之
長谷川 博道